9.21.262
Verified build release date: 27 July 2024
Full winIDEA version: 9.21.262.1.180999
Supported IDE features and graphics
Auto Start ICUM replaced by Force run
The option Auto Start ICUM in Hardware | CPU Options | SoC Advanced is replaced by Force run in Debug Entry Type drop down in Hardware | CPU Options | Cores | ICUM.
Previously:
Currently:
Build Manager - CMake
CMake is an open-source, cross-platform tool designed to manage the build process of software using a compiler-independent method. It generates build files for various build systems, including Unix Makefiles, Microsoft Visual Studio project files, and more.
CMake can be in enabled in Tools | Options | Environment | IDE | Select build manager.
A CMake toolbar can be enabled via View | Toolbars | CMake.
SPID password for Renesas RH850 G4
Serial Programmer ID (SPID) password field in Hardware | CPU Options | SoC is used to unlock SPID and enable read access to the Hardware Property Area region where the password is programmed.
Newly supported devices
Qorvo
QPF5100Q
Adding support.
Supported features:
•Debug: SWD, 1x Cortex-M33
•SFR
•UMI: Internal eFLASH
winIDEA version: 9.21.256.0.177908
SemiDrive
E3206/E3205
Adding support.
Supported features:
•Debug: SWD, JTAG, 1xCR5 (lockstep)
•SFR
•UMI: External SPI, HyperFlash (HyperBUS)
Variants:
•E3206
•E3205
winIDEA version: 9.21.257.0.178486
Renesas
RA8M1
Adding support.
Supported features:
•Debug: JTAG, SWD, M85
•WDOG disable script
•SFR
•UMI: Internal
•Trace: M85 ETM Parallel, M85 ETM SWO, M85 ETM ETB, M85 ITM Parallel, M85 ITM SWO, M85 ITM ETB, M85 DWT ITM Parallel, M85 DWT ITM SWO, M85 DWT ITM ETB
Variants:
•R7FA8M1xF
•R7FA8M1xH
winIDEA version: 9.21.261.0.179506
Flagchip
FC7240
Extending support.
Supported features:
•Debug: WDOG disable script
•Trace: ETM Parallel, DWT ITM Parallel
winIDEA version: 9.21.257.0.178184
Infineon
TC4D
Extending support.
Variants:
•TC4D7XP
winIDEA version: 9.21.256.0.176957
Supported features:
•Debug: SCR (8051) Private DAP
winIDEA version: 9.21.258.0.179142
Known issues
Refer to this document for more information.